PCB Industry moves eastward , the mainland is a unique show. The center of gravity of PCB industry is constantly shifting to Asia, and the production capacity in Asia is further shifting to the mainland, forming a new industrial pattern. With the continuous transfer of production capacity, the Chinese mainland has become the highest PCB production capacity in the world. According to Prismark’s estimate, China’s PCB output will reach 40 billion US dollars in 2020, accounting for more than 60 percent of the global total.

 

 

 

Data centers and other applications to increase the demand for HDI, FPC has a broad future. Data centers are developing towards the characteristics of high speed, large capacity, cloud computing and high performance, and the demand for construction is surging, among which the demand for servers will also pull up the overall demand for HDI. Smart phones and other mobile electronic products will also drive the rise in demand for FPC board. In the trend of intelligent and thin mobile electronic products, the advantages of FPC such as light weight, thin thickness and bending resistance will facilitate its wide application. The demand for FPC is increasing in the display module, touch module, fingerprint recognition module, side key, power key and other segments of smart phones.

 

 

 

“Raw material price increase + environmental protection supervision” under the increased concentration, leading manufacturers to welcome the opportunity. The rising prices of raw materials such as copper foil, epoxy resin and ink in the upstream of the industry transmitted cost pressure to PCB manufacturers. At the same time, the central government vigorously carried out environmental protection supervision, implemented environmental protection policies, cracked down on small manufacturers in disorder, and exerted cost pressure. Under the background of rising raw material prices and stricter environmental supervision, PCB industry reshuffle brings increased concentration. Small producers on downstream bargaining power is weak, difficult to digest the upstream prices, small and medium-sized enterprise for PCB will be because of the profit margins are narrow and the exit, in this round of PCB industry reshuffle, bibcock company has the technology and capital advantage, is expected to pass to expand capacity, acquisition and product upgrading way to realize scale expansion, with its efficient production process, good cost control based on directly benefit industry concentration. The industry is expected to return to rationality, and the industrial chain will continue to develop healthily.

 

 

 

New applications drive the growth of the industry, and the 5G era is approaching. New 5G communication base stations have a large demand for high-frequency circuit boards: compared with the number of millions of base stations in the 4G era, the scale of base stations in the 5G era is expected to exceed ten million levels. High-frequency and high-speed panels that meet the requirements of 5G have wider technical barriers compared with traditional products and higher gross profit margins.

 

 

 

The trend of automobile electronization is driving the rapid growth of automobile PCB. With the deepening of automobile electronization, the area of automotive PCB demand will gradually increase. Compared with traditional vehicles, new energy vehicles have higher requirements for the degree of electronization. The cost of electronic devices in traditional high-end cars accounts for about 25%, while in new energy vehicles, it reaches 45% ~ 65%. Among them, BMS will become a new growth point of automotive PCB, and the high frequency PCB carried by millimeter wave radar puts forward a large number of rigid requirements.

 

Our company will enlarge the invest in technology innovation of the MCPCB FPC, Rigid-flex PCB,copper core PCB,etc to catch the technology progress of the industry of aumobile,5G,etc.


Post time: Apr-09-2021