| Items |
Capability |
| Layer count |
1-40 layer |
| Laminates type |
FR-4(High Tg, Halogen Free, High Frequency) |
| FR-5, CEM-3, PTFE, BT, Getek, Aluminium base，Copper base，KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
| Board thickness |
0.2mm-6mm |
| Max Base copper weight |
210um (6oz) for inner layer 210um (6oz) for outer layer |
| Min mechanical drill size |
0.2mm (0.008") |
| Aspect ratio |
12:01
|
| Max panel size |
Sigle side or double sides:500mm*1200mm, |
| Multilayer layers:508mm X 610mm (20" X 24") |
| Min line width/space |
0.076mm / 0.0.076mm (0.003" / 0.003") |
| Via hole type |
Blind / Burried / Plugged(VOP,VIP…) |
| HDI / Microvia |
YES |
| Surface finish |
HASL |
| Lead Free HASL |
| Immersion Gold (ENIG), Immersion Tin, Immersion Silver |
| Organic Solderability Preservative (OSP) / ENTEK |
| Flash Gold(Hard Gold plating) |
| ENEPIG |
| Selective Gold Plating, Gold thickness up to 3um(120u") |
| Gold Finger, Carbon Print, Peelable S/M |
| Solder mask color |
Green, Blue, White, Black, Clear, etc. |
| Impedance |
Single trace,differential , coplanar impedance controlled ±10% |
| Outline finish type |
CNC Routing; V-Scoring / Cut; Punch |
| Tolerances |
Min Hole tolerance (NPTH) |
±0.05mm |
| Min Hole tolerance (PTH) |
±0.075mm |
| Min Pattern tolerance |
±0.05mm |
